Advanced Packaging Technologies

4 reasons Driving the Shift Toward Advanced Packaging? 1. Moore’s Law Slowdown For decades, the industry relied on shrinking transistors (Moore’s Law) to double performance every 18–24 months. But as we approach sub-3nm nodes, scaling becomes costlier, more complex, and yields drop. It’s no longer economically viable to put everything into one monolithic chip. ➤ Example: Intel and TSMC now integrate multiple smaller chips (chiplets) instead of one giant die. This allows them to continue performance gains without relying solely on node shrinkage. ➤ Analogy: Think of trying to build a mansion on a tiny plot of land — it gets harder and more expensive to squeeze more rooms (transistors) in. Advanced packaging is like building several smaller houses (chiplets) and connecting them with efficient roads (interconnects). 2. Need for Higher Performance and Energy Efficiency Modern applications — especially AI, 5G, AR/VR, and autonomous vehicles — require rapid data transfer between chips, low latency, and reduced power consumption. Advanced packaging allows chips (e.g., logic, memory, I/O) to be placed closer together, reducing signal travel distance, improving speed, and cutting power use. ➤ Example: NVIDIA’s H100 GPU uses HBM3 memory stacked closely using advanced packaging, which massively boosts bandwidth and energy efficiency. ➤ Analogy: It’s like relocating your kitchen, dining, and living areas closer together — less time and effort moving between them means faster and more efficient daily operations. 3. Demand from AI, HPC, and Data Centers AI training models (like ChatGPT), high-performance computing, and hyperscale data centers need massive processing and memory bandwidth — beyond what traditional packaging can deliver. Advanced packaging enables multi-die systems that behave like a single chip but are customized and scalable. ➤ Example: AMD’s EPYC processors use chiplet architecture — separate cores and I/O dies — to scale efficiently while reducing manufacturing cost and complexity. ➤ Analogy: Imagine one person trying to carry everything in a big suitcase (monolithic die). Instead, using multiple backpacks (chiplets) shared across a team (multi-die system) lets you carry more, faster, and more efficiently. 4. Rise of Chiplet-based Architectures to Reduce Cost and Improve Yield Instead of building a large, expensive chip with everything on it (which might fail in testing), companies now split the functions into smaller “chiplets”, manufactured separately and assembled into one package. This improves yield (less waste), flexibility (reuse components), and time-to-market. ➤ Example: Intel’s Meteor Lake uses chiplets built on different process nodes (e.g., TSMC for GPU, Intel for CPU), stitched together using Foveros 3D stacking. ➤ Analogy: It’s like assembling a laptop from modular parts (screen, keyboard, battery) — if one part fails, you can replace or improve just that part, rather than scrapping the entire system.

In the IEEE Open Journal of the Solid-State Circuits Society🏷️https://lnkd.in/gupeBDjB, engineers from TSMC published a review of critical design considerations for implementing high-bandwidth die-to-die (#D2D) #chiplet #interconnects. Excerpts (edited): 📝Serializers/de-serializers (#SerDes) operating at 56-112Gbps are commonly used in 2D/2.1D/2.2D/2.3D packages to maximize per-pin data rates. In contrast, 2.5D interposer-based packages are often equipped with high-speed parallel data links given their superior energy and area efficiencies. Meanwhile, advanced 3D-stacking technologies benefit most from simpler, lower-speed parallel links implemented with minimal buffers and flip-flops and no dedicated equalizer/calibration circuitry, thereby achieving higher data areal/bandwidth density and energy efficiency than 2.5D. 📝Regarding most flip-chip packages (2D/2.1D/2.2D/2.3D), the pitch of solder bumps and metal traces are relatively coarse. One is thus often forced to maximize per-pin data bandwidth density by means of serial links (e.g., PCIe-32/64Gbps, CEI-112/224Gbps) with differential signaling. 📝Advanced 2.5D packaging technologies allow one to apply a lower data rate per pin across a greater number of parallel, single-ended signaling links per unit-geometry to maximize bandwidth density (e.g., UCIe x64 at 4-32Gbps), while simplifying system design and enhancing energy efficiency. 📝3D-stacking’s density continues to rise (pitch P≤9μm). As per the latest #UCIe 2.0 standard, which covers UCIe-3D™, each 3D interconnect's active area should be smaller than the bump's area to maximize #interconnect efficiency (≜ Bandwidth Density x Energy Efficiency), and each parallel data link should be kept as "slow" as 5Gbps to ease the timing workload. No dedicated calibration or linear equalization is employed, thereby further reducing system complexity and overheads. 📝The decoupling-cap (#decap) types commonly seen in advanced packaging include—from top to bottom; depicted below—A) on-die decaps, which are usually super high-density, metal-insulator-metal capacitors (SHDMIM) of ~50nF/mm² capacitance density or silicon capacitors of ~10nF/mm², B) on-interposer decaps such as embedded deep-trench capacitors (eDTC) of >1000nF/mm², and C) on-package/substrate discrete decaps typically in the μF range. 🔍Observation: “Design & Technology Co-Optimization” (#DTCO) has become a catchall term for multi-faceted engineering considerations pertinent to advanced packaging and test. (Let’s all call ourselves DTCO professionals or simply, "DTCO Pros".) Further reading: 🏷️Full article: https://lnkd.in/gdq7wqP4 🏷️Sorting #Chiplets: https://lnkd.in/gjej2Yqk 🏷️Chiplet (V): https://lnkd.in/dUAk5PkP 🏷️Chiplet (VI): https://lnkd.in/gKKse9_x 🏷️Chiplet (VII): https://lnkd.in/gyr6ZrV6 🏷️Chiplet (VIII): https://lnkd.in/gzJeAQFV 🏷️UCIe at #IMAPS 2024: https://lnkd.in/gYDjZVwz 🏷️Chiplet Package Types: https://lnkd.in/g4HT59N4 ➟To be continued. #SiP

Advanced Packaging is the New Materials battleground. We’ve moved past monolithic chips. Today’s performance gains come from chiplet-based processors mixing CPUs, GPUs, accelerators, and memory in one package. But that leap hinges on materials breakthroughs we still haven’t mastered. → Interposers under fire.  Organic build‑up films (ABF) warp at tight pitches and sap signal integrity. Glass and ceramic‑core interposers promise flatter, lower‑loss alternatives—yet scaling them and matching their CTE to silicon is a steep climb. → Die‑attach dilemma.  Standard solders and epoxies crack under 3D stacking’s thermal/mechanical stress. We need die‑attach materials that cure at low temperature but stand up to 125 °C+ cycles without delaminating. → TIM bottleneck.  Three‑dimensional stacks can push heat flux above 500 W/cm². Liquid‑infused nanocomposite TIMs and graphene‑enhanced interfaces look great in the lab, but integrating them into wafer‑level packaging without voids is a nightmare. → Through‑silicon vias & wafer packaging.  Embedding TSVs demands dielectric liners that don’t fracture under thermal cycling. Ultra‑thin wafers only make the mismatch worse. The engineering community is racing on glass interposers, novel underfills, and nano‑TIMs. But until these materials scale reliably, packaging—not transistors—will throttle tomorrow’s computing power. Are materials scientists ready to fill these gaps? Or will advanced packaging remain the Achilles’ heel of chiplet performance? #AdvancedPackaging  #HeterogeneousIntegration  #ThermalManagement

TSMC’s Strategic Evolution: Reshaping the Semiconductor Landscape TSMC is rewriting the playbook for industry leadership in a time of geopolitical tension and relentless technological demand. Its "Foundry 2.0" strategy doesn’t just redefine its market—it reshapes the semiconductor ecosystem by integrating advanced packaging and assembly into the core of its business. Here’s the bigger picture: 1. Advanced Packaging as the New Frontier TSMC’s investments in chiplet architectures and 3D integration are creating a new performance paradigm, where modularity and scalability rival node scaling. Packaging innovation is becoming the next battleground for competitive advantage. 2. Reshoring: Strategic Alignment Over Profitability TSMC’s Arizona fabs signal a shift toward supply chain security over cost efficiency. Operating at near-zero gross profit might seem counterintuitive, but it’s a strategic move to align with national interests while securing long-term geopolitical trust. 3. Beyond Silicon: Materials and Ecosystem Integration The future lies in photonics, heterogeneous systems, and new materials, not just silicon scaling. TSMC’s focus on hybrid architectures signals where the industry must head to meet AI-driven demand. This isn’t just about maintaining dominance—it’s about reshaping the rules of competition. The semiconductor industry isn’t a linear race anymore; it’s a multidimensional chessboard. Companies that adapt to this complexity will drive the next wave of innovation. What’s your take on the future of the semiconductor industry? Let’s discuss. #Semiconductors #Innovation #TSMC #AdvancedPackaging #AI https://lnkd.in/g29s6Mt3

What’s the difference between 2.5D and 3D ICs? As Moore’s Law slows, the industry is shifting to system-level innovation—especially through advanced packaging. Two approaches lead the charge: 2.5D and 3D ICs. -> 2.5D ICs  Chips are placed side-by-side on a common interposer (silicon or glass), which routes connections between them.  Think of it as horizontal integration with higher bandwidth and lower latency than traditional PCBs. -> 3D ICs  Chips are stacked vertically and connected using TSVs (Through-Silicon Vias)—tiny vertical tunnels through silicon that shorten communication paths between layers. -> Analogy: 2.5D is like a city spread across one giant floor—buildings connected by roads. 3D is a skyscraper—floors stacked with elevators (TSVs) moving data vertically. Faster, denser, but harder to cool and build. 💡 Why it matters: These techniques help us move “beyond Moore” by: Increasing bandwidth Reducing latency Shrinking footprint Combining memory, logic, RF, and more in a single package -> Where it’s used: 2.5D: AMD GPUs, Xilinx FPGAs, HBM-connected AI accelerators 3D: Intel’s Foveros, Samsung HBM stacks, Apple M-series chips, and next-gen edge AI hardware Key takeaway:  It’s not just about smaller nodes anymore. Packaging is becoming the new performance lever—and how you connect dies matters as much as what you put on them. P.S. If you're looking for semiconductor news, and insights, check out our Blog The Semiconductor world—a guide to the chip industry in simple terms. Link in comments. #Semiconductors #AdvancedPackaging #2_5D #3DIC #HBM #AIChips #MooresLaw #SystemIntegration #TestFlow #ATOMS