Powering the Future of Semiconductors: Experience You Can Trust in Wafer Bump Electroplating
Advancing Semiconductor Technology Through Precision Electroplating
In today’s rapidly evolving semiconductor landscape, the demand for precise, reliable, and high-performance interconnects has never been greater. For over 20 years, our team has specialized in advanced electroplating bump technologies that enable next-generation semiconductor devices to perform with exceptional accuracy and consistency.
Our ISO-certified processes have been refined over decades of focused R&D, supporting some of the most demanding applications in military, aerospace, medical, and commercial semiconductor markets. From fine-pitch bumping to complex multi-metal plating, our capabilities span a wide range of materials — including gold, nickel, copper, tin, and specialized alloys — to meet stringent design and reliability requirements.
We understand that at the wafer level, every micron matters. Our ability to deliver uniform deposition across wafers of varying sizes, while maintaining tight dimensional control, is rooted in a culture of continuous improvement and precision engineering. This approach ensures not only manufacturability but long-term reliability — critical for mission‑critical and high-performance environments alike.
Our R&D division continues to innovate in metallization solutions, pushing the limits of miniaturization and bonding integrity. Whether developing fine bumps for advanced packaging, or enhancing corrosion‑resistant structures for harsh environments, we bring experience, materials science expertise, and process discipline to every collaboration.
At the intersection of science and manufacturing excellence, we take pride in being a trusted partner to organizations that depend on dependable wafer‑level metallurgy. As the semiconductor industry accelerates toward smaller geometries and greater integration, our electroplating expertise continues to support the technologies shaping tomorrow’s devices.
Contact: www.imi-corp.com
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